NEW DELHI (Reuters) – Taiwan’s Wistron Corp plans to assemble printed circuit boards (PCBs) for iPhones at its new plant in southern India, two sources said, highlighting Apple Inc’s push to expand manufacturing in the world’s second-biggest smartphone market.
FILE PHOTO: A salesman uses his iPhone at a mobile phone store in New Delhi, India, July 27, 2016. REUTERS/Adnan Abidi/File Photo
The local assembly of PCBs by Wistron’s India unit will be a first for the contract manufacturer, which began making Apple’s low-priced SE model in the southern tech hub of Bengaluru in 2017. It currently assembles the 6S and 7 iPhone models there as well.
A PCB is a bed for key components such as processors, memory and wireless chip sets that are the heart of an electronic device. Once assembled, or populated with components, PCBs account for about half the cost of a smartphone.
Wistron’s second iPhone plant, some 65 km (40 miles) from Bengaluru, is expected to become operational by…
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